Electronic circuit and method with thermal management

Abstract From the Canadian patent

The disclosure is directed to an improved circuit and method which utilizes a plurality of generally planar diamond substrate layers. Electronic circuit elements are mounted on each of the substrate layers and the substrate, layers are disposed in a stack. Heat exchange means can be coupled generally at the edges of the substrate layers. In a disclosed embodiment, a multiplicity of generally planar diamond substrate layers and a multiplicity of generally planar spacer boards are provided. Each of the substrate layers has mounted thereon a multiplicity of electronic elements and conductive means for coupling between electronic elements. In general, at least some of the electronic elements on …