Process and device for cutting a multilayer assembly formed of a plurality of thin layers and consisting of a thin layer electrochemical generator or of a part of such generator

Abstract From the Canadian patent

At leat one laser beam is focused on one side of the assembly (10) to be cut at a point (4) on said side which is part of the cutting profile and which is called the point of impact of said beam on said side in order to cause at that point a disintegration of the material of said assembly. The laser beam is moved (11 12) in relation to said assembly so that the impact point (4) describes a trajectory which corresponds to the desired cutting profile while maintaining a controlled atmosphere (15) in the area around said impact point. Uses particularly include cutting solid polymer electrolyte lithium thin film electrochemical generators or cutting precursors of such generators.