Multiple lamination high density interconnect process and structure employing a variable crosslinking adhesive
CA 2049272 C · Owner: Wojnarowski, Robert John · Inventors: Wojnarowski, Robert John; Weaver, Stanton Earl, Jr.; Gorczyca, Thomas Bert
Overview
Its claims, description and drawings are in the Canadian Patents Database.
Open the CIPO recordAbstract From the Canadian patent
A high density interconnect structure incorporating a plurality of laminated dielectric layers is fabricated using a SPI/epoxy crosslinking copolymer blend adhesive in order to maintain the stability of the already fabricated structure during the addition of the later laminations while also maintaining the repairability of the high density interconnect structure.
Read the whole patent
Listed from its CIPO record in Patent Yard's archive of Canadian patents past their term. Its claims, description and drawings are in the CIPO record and on Google Patents, and the Claude kit works from them.
Why it's free to use
- Filed August 15, 1991 and granted February 12, 2002. A Canadian patent filed from October 1, 1989 lasts 20 years from filing, so its term ended August 15, 2011.
- A certificate of supplementary protection adds at most two years for a drug, so even that would have ended by August 15, 2013.
- We check Canadian rights only. A patent in its family in another country could still be in force: check its family on Google Patents.
Timeline
Timeline From CIPO dates
Sources & verification
Official CIPO records
Everything on this page comes from the CIPO record linked above. Contains information licensed under the Open Government Licence – Canada.