Attaching integrated circuits to circuit boards
CA 2048035 A1 · Owner: Magee, David George · Inventors: Magee, David George; Carson, Mark Harley
Overview
Its claims, description and drawings are in the Canadian Patents Database.
Open the CIPO recordAbstract From the Canadian patent
A method of connecting an electronic component such as an integrated circuit to a circuit board comprises the steps of depositing solder in a predetermined pattern on contact zones of the electronic component; raising the deposited solder relative to the contact zones; bringing the electronic component and the circuit board into abutment so that the solder pattern on the one and complemental contact zones on the other are aligned; and reflowing the solder to join the component and the board. The deposited solder pattern can be formed by screen printing solder cream onto the contact zones. The solder can be reflowed to create solder bumps or may simply be deposited to the, required …
Read the whole patent
Listed from its CIPO record in Patent Yard's archive of Canadian patents past their term. Its claims, description and drawings are in the CIPO record and on Google Patents, and the Claude kit works from them.
Why it's free to use
- Filed July 29, 1991. No grant is recorded for it in Canada; had it been granted, its 20-year term would have ended July 29, 2011.
- A certificate of supplementary protection adds at most two years for a drug, so even that would have ended by July 29, 2013.
- We check Canadian rights only. A patent in its family in another country could still be in force: check its family on Google Patents.
Timeline
Timeline From CIPO dates
Sources & verification
Official CIPO records
Everything on this page comes from the CIPO record linked above. Contains information licensed under the Open Government Licence – Canada.