Method for batch cleaving semiconductor wafers and for coating the cleaved facets
CA 2043173 C · Owner: Broom, Ronald F. · Inventors: Broom, Ronald F.; Vettiger, Peter; Harder, Christoph Stephan
Overview
Its claims, description and drawings are in the Canadian Patents Database.
Open the CIPO recordAbstract From the Canadian patent
A method for cleaving semiconductor wafers or segments thereof, which, comprises placing the wafer (11) provided with scribe lines (15) defining the planes where cleaving is to take place inbetween a pair of flexible transport bands (12, 13) and guiding it around a curved large radius surface (21) therebyapplying a bending moment. With a moment of sufficient magnitude individual, bars (22) are broken off the wafer as this is advanced the bars having front- and, rear-end facets. On cleaving each bar, while still pressed against the curved surface, is automatically separated whereby mutual damage of the facets of neighbouring bars is prevented. For further handling e.g. for the transport of …
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Listed from its CIPO record in Patent Yard's archive of Canadian patents past their term. Its claims, description and drawings are in the CIPO record and on Google Patents, and the Claude kit works from them.
Why it's free to use
- Filed May 24, 1991 and granted September 21, 1993. A Canadian patent filed from October 1, 1989 lasts 20 years from filing, so its term ended May 24, 2011.
- A certificate of supplementary protection adds at most two years for a drug, so even that would have ended by May 24, 2013.
- We check Canadian rights only. A patent in its family in another country could still be in force: check its family on Google Patents.
Timeline
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Sources & verification
Official CIPO records
Everything on this page comes from the CIPO record linked above. Contains information licensed under the Open Government Licence – Canada.