Multilayer interconnection substrate
CA 2042823 C · Owner: Hasegawa, Shinichi · Inventors: Hasegawa, Shinichi
Overview
Its claims, description and drawings are in the Canadian Patents Database.
Open the CIPO recordAbstract From the Canadian patent
A multilayer interconnection substrate comprising the first to third power interconnections provided with the first to third interconnection layers the first, insulating layer provided between said first and second interconnection layers, the second insulating layer provided between said second and third interconnection layers, a plurality of the first via holes which are provided at said first insulating layer and connect said first and second power interconnections and a plurality of the second via holes which are provided at said second insulating layer with the position being shifted from that of said first via holes and connect said second and third power interconnection. The substrate …
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Listed from its CIPO record in Patent Yard's archive of Canadian patents past their term. Its claims, description and drawings are in the CIPO record and on Google Patents, and the Claude kit works from them.
Why it's free to use
- Filed May 17, 1991 and granted July 9, 1996. A Canadian patent filed from October 1, 1989 lasts 20 years from filing, so its term ended May 17, 2011.
- A certificate of supplementary protection adds at most two years for a drug, so even that would have ended by May 17, 2013.
- We check Canadian rights only. A patent in its family in another country could still be in force: check its family on Google Patents.
Timeline
Timeline From CIPO dates
Sources & verification
Official CIPO records
Everything on this page comes from the CIPO record linked above. Contains information licensed under the Open Government Licence – Canada.