Photosensitive resin composition and method of forming conductive pattern
CA 2040482 C · Owner: Marutsuka, Toshinori · Inventors: Marutsuka, Toshinori; Suzuki, Toshio
Overview
Its claims, description and drawings are in the Canadian Patents Database.
Open the CIPO recordAbstract From the Canadian patent
A photosensitive resin composition formed by dissolving a photosensitive resin and a metallic salt or a metal complex in a common solvent or by dispersing reduced metal colloid particles in a photosensitive resin. Also disclosed is a method of forming electrically conductive patterns by applying the photosensitive resin composition to a substrate, pre-baking the resin and then successively subjecting it to exposure, development and post-baking. The result is subjected to electroless plating directly in, the case of the photosensitive resin containing dispersed metal colloid particles, and after reducing the metallic salt or a metal complex to a metal in the case of the photosensitive resin …
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Listed from its CIPO record in Patent Yard's archive of Canadian patents past their term. Its claims, description and drawings are in the CIPO record and on Google Patents, and the Claude kit works from them.
Why it's free to use
- Filed April 15, 1991 and granted November 10, 1998. A Canadian patent filed from October 1, 1989 lasts 20 years from filing, so its term ended April 15, 2011.
- A certificate of supplementary protection adds at most two years for a drug, so even that would have ended by April 15, 2013.
- We check Canadian rights only. A patent in its family in another country could still be in force: check its family on Google Patents.
Timeline
Timeline From CIPO dates
Sources & verification
Official CIPO records
Everything on this page comes from the CIPO record linked above. Contains information licensed under the Open Government Licence – Canada.