Epoxy resin compositions for encapsulating semi conductive elements
CA 2036414 A1 · Owner: Konishi, Isako · Inventors: Konishi, Isako; Kurio, Takuya; Nakanishi, Yoshinoi
Overview
Its claims, description and drawings are in the Canadian Patents Database.
Open the CIPO recordAbstract From the Canadian patent
Epoxy resin compositions for encapsulating semiconductive elements showing when cured a high glass transition temperature an, excellent crack resistance under soldering and a low chlorine ion generation rate upon curing comprising (a) epoxy resin (b) phenolic curing agent (c) tris(dialkoxyphenyl) phosphine represented by the general formula (I):, (I), wherein R1 and R2 each may represent a C1-4 alkyl group and (d) inorganic filler. C10/T1197FF
Read the whole patent
Listed from its CIPO record in Patent Yard's archive of Canadian patents past their term. Its claims, description and drawings are in the CIPO record and on Google Patents, and the Claude kit works from them.
Why it's free to use
- Filed February 15, 1991. No grant is recorded for it in Canada; had it been granted, its 20-year term would have ended February 15, 2011.
- A certificate of supplementary protection adds at most two years for a drug, so even that would have ended by February 15, 2013.
- We check Canadian rights only. A patent in its family in another country could still be in force: check its family on Google Patents.
Timeline
Timeline From CIPO dates
Sources & verification
Official CIPO records
Everything on this page comes from the CIPO record linked above. Contains information licensed under the Open Government Licence – Canada.