Method of forming a solder layer on pads of a circuit board and method of mounting an electronic part on a circuit board
CA 2030865 C · Owner: Fuse, Kenichi · Inventors: Kohno, Masanao; Fuse, Kenichi; Fukunaga, Takao
Overview
Its claims, description and drawings are in the Canadian Patents Database.
Open the CIPO recordAbstract From the Canadian patent
A paste-like composition containing a lead salt of an organic acid and tin powder is applied on a pad array portion of a citcuit board. Then, the paste-like composition is heated so as to cause precipitation thereby, forming a solder layer formed of an Sn-Pb alloy substantially only on pads. This precipitation is performed in a state that a liquid pool is formed on the pad array portion when the paste-like composition is liquified by heating, and the tin powder is settled in the liquid pool. When an electronic part is to be mounted on the pads, first, preparatory solder layers are formed on the pads by the above-mentioned precipitation process. After a paste-like composition is applied on …
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Listed from its CIPO record in Patent Yard's archive of Canadian patents past their term. Its claims, description and drawings are in the CIPO record and on Google Patents, and the Claude kit works from them.
Why it's free to use
- Filed November 26, 1990 and granted January 12, 1993. A Canadian patent filed from October 1, 1989 lasts 20 years from filing, so its term ended November 26, 2010.
- A certificate of supplementary protection adds at most two years for a drug, so even that would have ended by November 26, 2012.
- We check Canadian rights only. A patent in its family in another country could still be in force: check its family on Google Patents.
Timeline
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Sources & verification
Official CIPO records
Everything on this page comes from the CIPO record linked above. Contains information licensed under the Open Government Licence – Canada.