Process for producing flexible printed circuit board
CA 2030200 A1 · Owner: Nagano, Hirosaku · Inventors: Nojiri, Hitoshi; Ito, Hiroshi; Furutani, Hiroyuki
Overview
Its claims, description and drawings are in the Canadian Patents Database.
Open the CIPO recordAbstract From the Canadian patent
A process for producing a flexible printed circuit board comprising a metallic foil and a polyimide is provided which comprises coating a metallic foil with a resin solution prepared by adding a tertiary amino compound to a solution of a polyamic acid (a polyimide precursor) represented by the following general formula (I): ( I ), followed by the imidization thereof the amount of said, tertiary amino compound added to the solution being 10 to 50 parts by weight per 100 parts by weight of solid polyamic acid contained in said resin solution. According to the present invention, a flexible printed circuit board Which is free from curling, wrinkling and warping and which has, excellent heat …
Read the whole patent
Listed from its CIPO record in Patent Yard's archive of Canadian patents past their term. Its claims, description and drawings are in the CIPO record and on Google Patents, and the Claude kit works from them.
Why it's free to use
- Filed November 16, 1990. No grant is recorded for it in Canada; had it been granted, its 20-year term would have ended November 16, 2010.
- A certificate of supplementary protection adds at most two years for a drug, so even that would have ended by November 16, 2012.
- We check Canadian rights only. A patent in its family in another country could still be in force: check its family on Google Patents.
Timeline
Timeline From CIPO dates
Sources & verification
Official CIPO records
Everything on this page comes from the CIPO record linked above. Contains information licensed under the Open Government Licence – Canada.