Modified high density backplane connector
CA 2029648 C · Owner: Augat Inc. · Inventors: Marian, Steven Paul
Overview
Its claims, description and drawings are in the Canadian Patents Database.
Open the CIPO recordAbstract From the Canadian patent
A modified high density backplane (MHDB) connector is provided for electrically interconnecting high density printed circuit boards having predetermined interconnect circuitry including high density arrays of ground/signal contact pads discrete power pads and discrete ground pads. The MHDB connector includes one or more contact modules, a connector housing a pcb, biasing mechanism, connector end caps a flexible film, two, interactive biasing modules for each contact module and a, camming member secured to the pcb to be mated. The MHDB connector may also include one or more power contact modules and one or more mounting blocks as intermediate spacing/securing elements and/or end-positioned …
Read the whole patent
Listed from its CIPO record in Patent Yard's archive of Canadian patents past their term. Its claims, description and drawings are in the CIPO record and on Google Patents, and the Claude kit works from them.
Why it's free to use
- Filed November 9, 1990 and granted November 30, 1993. A Canadian patent filed from October 1, 1989 lasts 20 years from filing, so its term ended November 9, 2010.
- A certificate of supplementary protection adds at most two years for a drug, so even that would have ended by November 9, 2012.
- We check Canadian rights only. A patent in its family in another country could still be in force: check its family on Google Patents.
Timeline
Timeline From CIPO dates
Sources & verification
Official CIPO records
Everything on this page comes from the CIPO record linked above. Contains information licensed under the Open Government Licence – Canada.