Electroless copper plating process and apparatus
CA 2029090 C · Owner: Macdermid, Incorporated · Inventors: Donlon, Edward T.; Kukanskis, Peter E.
Overview
Its claims, description and drawings are in the Canadian Patents Database.
Open the CIPO recordAbstract From the Canadian patent
An electroless metal plating process, particularly for use in plating through-holes in printed circuit substrates, and more particularly for additively depositing copper metal on through-hole surfaces, in which the substrate is at least intermittently subjected to vibrating motion in contact with the electroless depositing bath and an electroless metal depositing apparatus for carrying out the process.
Read the whole patent
Listed from its CIPO record in Patent Yard's archive of Canadian patents past their term. Its claims, description and drawings are in the CIPO record and on Google Patents, and the Claude kit works from them.
Why it's free to use
- Filed October 31, 1990 and granted April 14, 1998. A Canadian patent filed from October 1, 1989 lasts 20 years from filing, so its term ended October 31, 2010.
- A certificate of supplementary protection adds at most two years for a drug, so even that would have ended by October 31, 2012.
- We check Canadian rights only. A patent in its family in another country could still be in force: check its family on Google Patents.
Timeline
Timeline From CIPO dates
Sources & verification
Official CIPO records
Everything on this page comes from the CIPO record linked above. Contains information licensed under the Open Government Licence – Canada.