Electronic device sealing resin compositions and sealed electronic devices
CA 2026801 A1 · Owner: Sakaguchi, Yasuo · Inventors: Sakaguchi, Yasuo; Suzuki, Keiichiro
Overview
Its claims, description and drawings are in the Canadian Patents Database.
Open the CIPO recordAbstract From the Canadian patent
Disclosed herein are electronic device sealing resin compositions containing 100 parts by weight of a thermoplastic resin mixture composed of 25-60 wt.% of a poly(arylene sulfide) and 40-75 wt.% of an inorganic filler; and 1.5-5 parts by weight of an epoxy-modified silicone oil having an epoxy equivalent of 350-1,000 g/eqiv. Also disclosed are electronic devices sealed using such resin compositions.
Read the whole patent
Listed from its CIPO record in Patent Yard's archive of Canadian patents past their term. Its claims, description and drawings are in the CIPO record and on Google Patents, and the Claude kit works from them.
Why it's free to use
- Filed October 3, 1990. No grant is recorded for it in Canada; had it been granted, its 20-year term would have ended October 3, 2010.
- A certificate of supplementary protection adds at most two years for a drug, so even that would have ended by October 3, 2012.
- We check Canadian rights only. A patent in its family in another country could still be in force: check its family on Google Patents.
Timeline
Timeline From CIPO dates
Sources & verification
Official CIPO records
Everything on this page comes from the CIPO record linked above. Contains information licensed under the Open Government Licence – Canada.