Thermocompression bonding in integrated circuit packaging
CA 2024012 C · Owner: Topa, Robert D. · Inventors: Kang, Sung K.; Topa, Robert D.; Palmer, Michael J.
Overview
Its claims, description and drawings are in the Canadian Patents Database.
Open the CIPO recordAbstract From the Canadian patent
A contact member for thermocompression bonding in integrated circuit packaging has on a conductor end a uniform texture deformable layer with a hardness value in the range of that of soft gold which is approximately 90 on the Knoop scale and with a rough surface morphology having ridges with approximately 1 micrometer modulation frequency and a depth between ridges of from 1/4 to 1/2 that of the average integrated circuit pad. The deformable layer is produced by plating gold in a strong electronegative plating bath within a range of 0.03 to 0.05 mA/sq.cm. current density. Plating apparatus for, plating different areas, with different electronegative conditions, with separate independently …
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Listed from its CIPO record in Patent Yard's archive of Canadian patents past their term. Its claims, description and drawings are in the CIPO record and on Google Patents, and the Claude kit works from them.
Why it's free to use
- Filed August 24, 1990 and granted March 5, 1996. A Canadian patent filed from October 1, 1989 lasts 20 years from filing, so its term ended August 24, 2010.
- A certificate of supplementary protection adds at most two years for a drug, so even that would have ended by August 24, 2012.
- We check Canadian rights only. A patent in its family in another country could still be in force: check its family on Google Patents.
Timeline
Timeline From CIPO dates
Sources & verification
Official CIPO records
Everything on this page comes from the CIPO record linked above. Contains information licensed under the Open Government Licence – Canada.