Bonding tool
CA 2023933 C · Owner: Nakai, Tetsuo · Inventors: Imai, Takahiro; Ikegaya, Akihiko; Nakai, Tetsuo
Overview
Its claims, description and drawings are in the Canadian Patents Database.
Open the CIPO recordAbstract From the Canadian patent
A bonding tool ABSTRACT OF THE DISCLOSURE, A bonding tool for TAB used in the production of, semiconductor chips which is provided with, at the end thereof, a substrate consisting of a member selected from the group consisting of sintered compacts of Si or Si3N4 as a predominant component, sintered compacts of SiC as a predominant component, sintered compacts of AlN as a predominant component and composite compacts thereof, the substrate being coated with polycrystalline diamond deposited by gaseous phase synthesis method.
Read the whole patent
Listed from its CIPO record in Patent Yard's archive of Canadian patents past their term. Its claims, description and drawings are in the CIPO record and on Google Patents, and the Claude kit works from them.
Why it's free to use
- Filed August 24, 1990 and granted November 9, 1993. A Canadian patent filed from October 1, 1989 lasts 20 years from filing, so its term ended August 24, 2010.
- A certificate of supplementary protection adds at most two years for a drug, so even that would have ended by August 24, 2012.
- We check Canadian rights only. A patent in its family in another country could still be in force: check its family on Google Patents.
Timeline
Timeline From CIPO dates
Sources & verification
Official CIPO records
Everything on this page comes from the CIPO record linked above. Contains information licensed under the Open Government Licence – Canada.