Process for the direct metallization of a non-conducting substrate
CA 2023846 A1 · Owner: Middeke, Hermann-Josef · Inventors: Meyer, Habil; Middeke, Hermann-Josef; Majentny, Klaus
Overview
Its claims, description and drawings are in the Canadian Patents Database.
Open the CIPO recordAbstract From the Canadian patent
The present invention relates to a process for the direct metallization of a non-conducting substrate particularly, for the production of printed circuits which is characterized by, the following process steps: pre-cleaning when required, pre-, corroding, pre-swelling the surface to be metallized coating the surface with an adhesive adsorption of a metal compound reaction of the metal compound to the metal galvanic metallization.
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Listed from its CIPO record in Patent Yard's archive of Canadian patents past their term. Its claims, description and drawings are in the CIPO record and on Google Patents, and the Claude kit works from them.
Why it's free to use
- Filed August 23, 1990. No grant is recorded for it in Canada; had it been granted, its 20-year term would have ended August 23, 2010.
- A certificate of supplementary protection adds at most two years for a drug, so even that would have ended by August 23, 2012.
- We check Canadian rights only. A patent in its family in another country could still be in force: check its family on Google Patents.
Timeline
Timeline From CIPO dates
Sources & verification
Official CIPO records
Everything on this page comes from the CIPO record linked above. Contains information licensed under the Open Government Licence – Canada.