Cooling system for a semiconductor element, semiconductor module including such a system and a thermally conductive member therefor

Abstract From the Canadian patent

A cooling system for a semiconductor element comprises a heat flow path including a thermally conductive member interposed between a surface of the element and a surface of a cooling block for conducting heat between them. The member is slidable relative to at least one of the surfaces at a region on of sliding contact. To reduce wear, without reducing thermal conductivity, at the region of sliding contact at, least one of the thermally conductive member and the surface contacted thereby carries a fixed thin film comprising fluorine-containing lubricant of thickness, preferably in the range 2 nm to 100 nm. The fluorinecontaining lubricant is chemically bonded to the surface carrying it, or …