Molded circuit component unit for connecting lead wires and a method of manufacturing same
CA 2022526 C · Owner: Sankyo Kasei, Co. Ltd. · Inventors: Kawasaki, Syusaku; Yoshizawa, Norio; Sugawara, Kiyoto
Overview
Its claims, description and drawings are in the Canadian Patents Database.
Open the CIPO recordAbstract From the Canadian patent
A molded circuit component for connecting to lead wires includes body and a protective cover. The body includes a partition wall area having a plurality of housing grooves, partition walls, body notches positioning projections and fastening pin reception apertures. The protective cover includes a plurality of cover notches, recesses and fastening pins to correspond respectively with the body notches positioning projections and fastening pin reception apertures. Metal lines having connection terminals on their ends are embedded in the housing grooves. Lead wires are positioned in the grooves so that the conductors of the lead wires are placed on and, attached to, the connection terminals. …
Read the whole patent
Listed from its CIPO record in Patent Yard's archive of Canadian patents past their term. Its claims, description and drawings are in the CIPO record and on Google Patents, and the Claude kit works from them.
Why it's free to use
- Filed August 2, 1990 and granted September 3, 1996. A Canadian patent filed from October 1, 1989 lasts 20 years from filing, so its term ended August 2, 2010.
- A certificate of supplementary protection adds at most two years for a drug, so even that would have ended by August 2, 2012.
- We check Canadian rights only. A patent in its family in another country could still be in force: check its family on Google Patents.
Timeline
Timeline From CIPO dates
Sources & verification
Official CIPO records
Everything on this page comes from the CIPO record linked above. Contains information licensed under the Open Government Licence – Canada.