Method and apparatus for automatically bonding film to a substrate and cutting the film to desired size

Abstract From the Canadian patent

An apparatus for bonding a thin film to the surface of a substrate wherein the film is supplied from a continuous roll to a bonding position where a roller applies heat and pressure to cause the film to be bonded to the substrate. A rotary cutter rapidly cuts the continuous film to a length which fits precisely over the substrate. The cutter comprises a stationary knife and a rotary knife which are disposed on opposite sides of the continuous film. The knives are moveable between a cutting position and a non cutting position and are adjustable to provide in the cutting position a rapid cut of the film transversed to the direction of film travel. The apparatus is operative to hold the …