Power semiconductor package
CA 2018808 C · Owner: Hughes Aircraft Company · Inventors: Estes, Earl M. Jr.
Overview
Its claims, description and drawings are in the Canadian Patents Database.
Open the CIPO recordAbstract From the Canadian patent
A hermetically sealed power semiconductor package includes a body 11 and a thick metal back 24. The metal back serves as a mounting device as well as a thermal channel for the package eliminating the need for intermediate heatsinks. For example fasteners 47, extending into the back 24 can be used to mount the package to a printed wiring board 38 and directly to a heatsink 44.
Read the whole patent
Listed from its CIPO record in Patent Yard's archive of Canadian patents past their term. Its claims, description and drawings are in the CIPO record and on Google Patents, and the Claude kit works from them.
Why it's free to use
- Filed June 12, 1990 and granted May 11, 1993. A Canadian patent filed from October 1, 1989 lasts 20 years from filing, so its term ended June 12, 2010.
- A certificate of supplementary protection adds at most two years for a drug, so even that would have ended by June 12, 2012.
- We check Canadian rights only. A patent in its family in another country could still be in force: check its family on Google Patents.
Timeline
Timeline From CIPO dates
Sources & verification
Official CIPO records
Everything on this page comes from the CIPO record linked above. Contains information licensed under the Open Government Licence – Canada.