Ultra-tall indium or alloy bump array for ir detector hybrids and micro-electronics
CA 2017743 C · Owner: D'Agostino, Saverio A. · Inventors: Hu, William C.; Longerich, Ernest P.; D'Agostino, Saverio A.
Overview
Its claims, description and drawings are in the Canadian Patents Database.
Open the CIPO recordAbstract From the Canadian patent
Method for improving particular interconnect pads for microcircuitry so that they provide more compliant interconnections between opposed pairs of contacts of the microchips in a hybrid detector array assembly. The individual tubes of prior art interconnect pads are filled with indium and are then etched away to leave indium columns of increased height, relative to the indium bumps that have heretofore been used in the contact connections of hybrid detector array assemblies. Other materials may be substituted for the indium and a number of variants of the process are also disclosed.
Read the whole patent
Listed from its CIPO record in Patent Yard's archive of Canadian patents past their term. Its claims, description and drawings are in the CIPO record and on Google Patents, and the Claude kit works from them.
Why it's free to use
- Filed May 29, 1990 and granted February 6, 1996. A Canadian patent filed from October 1, 1989 lasts 20 years from filing, so its term ended May 29, 2010.
- A certificate of supplementary protection adds at most two years for a drug, so even that would have ended by May 29, 2012.
- We check Canadian rights only. A patent in its family in another country could still be in force: check its family on Google Patents.
Timeline
Timeline From CIPO dates
Sources & verification
Official CIPO records
Everything on this page comes from the CIPO record linked above. Contains information licensed under the Open Government Licence – Canada.