Process for making hybrid microcircuits providing accurate thick film resistor printing

Abstract From the Canadian patent

An improved process for fabricating thick film hybrid microcircuits that produces thick film resistors having electrical characteristics consistent with the microcircuit design tolerances, in areas proximate a dielectric build-up. The process includes establishing, by printing and firing a plurality of first conductor traces including the cross-under conductors to a substrate. Next, the resistive elements are printed and fired on the substrate and a dielectric glaze printed and fired over the resistive elements. At least one dielectric layer is then printed and fired over the cross-under conductors. A plurality of second conductor traces are next printed and fired on the substrate including …