Chip package capacitor cover
CA 2014255 C · Owner: Samsung Electronics Co. Ltd. · Inventors: Spielberger, Richard K.
Overview
Its claims, description and drawings are in the Canadian Patents Database.
Open the CIPO recordAbstract From the Canadian patent
A cover 10 for a semiconductor chip package 50. Cover 10 comprises a sealing surface for providing a seal between cover 10 and a semiconductor chip package 50. A mounting surface 12 for mounting a capacitor 14 to the surface of cover 10 is provided. The mounting surface 12 comprises metalization including a metalized power pad 20 and a metalized ground pad 22 for mounting at least one capacitor 14 on surface 12 of the cover.
Read the whole patent
Listed from its CIPO record in Patent Yard's archive of Canadian patents past their term. Its claims, description and drawings are in the CIPO record and on Google Patents, and the Claude kit works from them.
Why it's free to use
- Filed April 10, 1990 and granted December 26, 2000. A Canadian patent filed from October 1, 1989 lasts 20 years from filing, so its term ended April 10, 2010.
- A certificate of supplementary protection adds at most two years for a drug, so even that would have ended by April 10, 2012.
- We check Canadian rights only. A patent in its family in another country could still be in force: check its family on Google Patents.
Timeline
Timeline From CIPO dates
Sources & verification
Official CIPO records
Everything on this page comes from the CIPO record linked above. Contains information licensed under the Open Government Licence – Canada.