Expired Canadian patentCanada
Process for reflow soldering
CA 2011030 C · Owner: The Boc Group, Inc. · Inventors: Bandyopadhyay, Nikhiles; Kirschner, Mark J.
Overview
Drawings and full text
Its claims, description and drawings are in the Canadian Patents Database.
Open the CIPO recordAbstract From the Canadian patent
A method of joining components to a substrate by reflow soldering with non-rosin-based flux containing solder is disclosed comprising heating the solder in the presence of the components in a low oxidizing atmosphere.
Read the whole patent
Listed from its CIPO record in Patent Yard's archive of Canadian patents past their term. Its claims, description and drawings are in the CIPO record and on Google Patents, and the Claude kit works from them.
Why it's free to use
- Filed February 27, 1990 and granted October 18, 1994. A Canadian patent filed from October 1, 1989 lasts 20 years from filing, so its term ended February 27, 2010.
- A certificate of supplementary protection adds at most two years for a drug, so even that would have ended by February 27, 2012.
- We check Canadian rights only. A patent in its family in another country could still be in force: check its family on Google Patents.
FiledFebruary 27, 1990
GrantedOctober 18, 1994
Term endedFebruary 27, 2010
Patent numberCA 2011030 C
Classification (IPC)B23K1/00 +2 more
Timeline
Timeline From CIPO dates
Sources & verification
Official CIPO records
Everything on this page comes from the CIPO record linked above. Contains information licensed under the Open Government Licence – Canada.