Solder assembly of components
CA 2011000 C · Owner: Oien, Michael Ackman · Inventors: Pelosi, Walter; Clark, William Albert; Oien, Michael Ackman
Overview
Its claims, description and drawings are in the Canadian Patents Database.
Open the CIPO recordAbstract From the Canadian patent
Disclosed is a method and resulting product involving soldering of components, such as the soldering of flexible circuits (10) to printed circuit boards (14). Holes (13) are provided in the areas of one component which are to be soldered to pads (15) on the other component. Precise amounts of solder (30) areprovided to each pad preferably by means of a shuttle element (20) which carries solder paste in cavities (21) corresponding to the pads and which deposits the solder on the pads when the solder is melted. The holes in the component are aligned with the pads, and the solder is reflowed so that a visible solder fillet (31) is formed above the holes to permit inspection of the solder joint.
Read the whole patent
Listed from its CIPO record in Patent Yard's archive of Canadian patents past their term. Its claims, description and drawings are in the CIPO record and on Google Patents, and the Claude kit works from them.
Why it's free to use
- Filed February 27, 1990 and granted December 9, 1997. A Canadian patent filed from October 1, 1989 lasts 20 years from filing, so its term ended February 27, 2010.
- A certificate of supplementary protection adds at most two years for a drug, so even that would have ended by February 27, 2012.
- We check Canadian rights only. A patent in its family in another country could still be in force: check its family on Google Patents.
Timeline
Timeline From CIPO dates
Sources & verification
Official CIPO records
Everything on this page comes from the CIPO record linked above. Contains information licensed under the Open Government Licence – Canada.