Connecting apparatus
CA 2010306 C · Owner: Kawano, Kyoichiro · Inventors: Tsuji, Hiroki; Kawano, Kyoichiro; Murase, Teruo
Overview
Its claims, description and drawings are in the Canadian Patents Database.
Open the CIPO recordAbstract From the Canadian patent
A porous silver plating layer is provided on the surfaces of pads of a printed circuit board and the contact surfaces provided on the pads of a mother board and these layers are respectively impregnated by tin-zinc alloy and gallium. An electrical connection is established between the pads of the printed circuit board and the pads of the mother board through the formation of a liquid alloy by placing these plating layers in contact with each other. For the one printed circuit board having the pads and spacer, the gallium particles are adhered to the pads, while the solder is tentatively adhered to the spacer and for the other printed circuit board having the pads and connecting pads, the …
Read the whole patent
Listed from its CIPO record in Patent Yard's archive of Canadian patents past their term. Its claims, description and drawings are in the CIPO record and on Google Patents, and the Claude kit works from them.
Why it's free to use
- Filed February 19, 1990 and granted August 17, 1993. A Canadian patent filed from October 1, 1989 lasts 20 years from filing, so its term ended February 19, 2010.
- A certificate of supplementary protection adds at most two years for a drug, so even that would have ended by February 19, 2012.
- We check Canadian rights only. A patent in its family in another country could still be in force: check its family on Google Patents.
Timeline
Timeline From CIPO dates
Sources & verification
Official CIPO records
Everything on this page comes from the CIPO record linked above. Contains information licensed under the Open Government Licence – Canada.