Multi-layer ceramic substrate with solder dam on connecting pattern
CA 2008284 C · Owner: Fujitsu Limited · Inventors: Satou, Kazuaki
Overview
Its claims, description and drawings are in the Canadian Patents Database.
Open the CIPO recordAbstract From the Canadian patent
A multi-layer ceramic substrate assembly comprising a multi-layer ceramic substrate including a viaconductor and an interconnecting line and having a surface, a first soldering pad on the surface of the substrate and connected to the via-conductor a second, soldering pad on the surface of the substrate adjacent to the first soldering pad, a connecting pattern on the surface of the substrate for connecting the first and second soldering pads, the connecting pattern being made of an electric conductor wettable with a solder and a, solder dam formed on the connecting pattern between the first and second soldering pads, the solder dam being made of a metal or a metal alloy or compound not …
Read the whole patent
Listed from its CIPO record in Patent Yard's archive of Canadian patents past their term. Its claims, description and drawings are in the CIPO record and on Google Patents, and the Claude kit works from them.
Why it's free to use
- Filed January 22, 1990 and granted February 22, 1994. A Canadian patent filed from October 1, 1989 lasts 20 years from filing, so its term ended January 22, 2010.
- A certificate of supplementary protection adds at most two years for a drug, so even that would have ended by January 22, 2012.
- We check Canadian rights only. A patent in its family in another country could still be in force: check its family on Google Patents.
Timeline
Timeline From CIPO dates
Sources & verification
Official CIPO records
Everything on this page comes from the CIPO record linked above. Contains information licensed under the Open Government Licence – Canada.