Single atmosphere for firing copper compatible thick film materials
CA 2007199 C · Owner: Tamhankar, Satish S. · Inventors: Tamhankar, Satish S.; Kirschner, Mark J.
Overview
Its claims, description and drawings are in the Canadian Patents Database.
Open the CIPO recordAbstract From the Canadian patent
The present invention provides an improved method for firing thick film inks in hybrid circuits which comprises firing different copper compatible thick film materials in a single firing atmosphere. The method comprises the steps of providing a paste suitable for application to a ceramic substrate applying the paste to the substrate by a conventional technique such as screen printing drying, the substrate, and firing the substrate at an elevated temperature in an ambient comprising an inert gas and carbon dioxide to form the electrical component. In another embodiment the substrate is fired in an ambient comprising only carbon dioxide.
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Listed from its CIPO record in Patent Yard's archive of Canadian patents past their term. Its claims, description and drawings are in the CIPO record and on Google Patents, and the Claude kit works from them.
Why it's free to use
- Filed January 5, 1990 and granted May 18, 1993. A Canadian patent filed from October 1, 1989 lasts 20 years from filing, so its term ended January 5, 2010.
- A certificate of supplementary protection adds at most two years for a drug, so even that would have ended by January 5, 2012.
- We check Canadian rights only. A patent in its family in another country could still be in force: check its family on Google Patents.
Timeline
Timeline From CIPO dates
Sources & verification
Official CIPO records
Everything on this page comes from the CIPO record linked above. Contains information licensed under the Open Government Licence – Canada.