Method for mounting an electronic component and memory card using same
CA 2003229 C · Owner: Boucquet, Jan Paul · Inventors: Boucquet, Jan Paul
Overview
Its claims, description and drawings are in the Canadian Patents Database.
Open the CIPO recordAbstract From the Canadian patent
A method for mounting a LSI chip (1) with conductive bumps (2, 3, 4) as terminals into a hole (15) of a card (5) and for interconnecting them. The card and therefore one end of the hole is first covered by a layer (16) of a conductive material. Then the conductive bumps of the chip Placed in the hole are soldered to the layer whilst being pressed against this layer. Thus protrusions (17 18, 19), are created on the external surface of the layer. These protrusions are used to facilitate the alignment of the mask used during the subsequent etching operation of the layer. The invention also concerns a process for creating the conductive bumps (2, 3, 4) on the terminal pads (6 7, 8) of the LSI …
Read the whole patent
Listed from its CIPO record in Patent Yard's archive of Canadian patents past their term. Its claims, description and drawings are in the CIPO record and on Google Patents, and the Claude kit works from them.
Why it's free to use
- Filed November 17, 1989 and granted July 12, 1994. A Canadian patent filed from October 1, 1989 lasts 20 years from filing, so its term ended November 17, 2009.
- A certificate of supplementary protection adds at most two years for a drug, so even that would have ended by November 17, 2011.
- We check Canadian rights only. A patent in its family in another country could still be in force: check its family on Google Patents.
Timeline
Timeline From CIPO dates
Sources & verification
Official CIPO records
Everything on this page comes from the CIPO record linked above. Contains information licensed under the Open Government Licence – Canada.