Copper doped low melt solder for component assembly and rework
CA 2000301 C · Owner: Niedrich, Daniel Scott · Inventors: Niedrich, Daniel Scott
Overview
Its claims, description and drawings are in the Canadian Patents Database.
Open the CIPO recordAbstract From the Canadian patent
Low melting temperature copper-containing solders are disclosed for soldering and rework on copper surfaces. The amount of copper required in the solder in order to inhibit dissolution of the copper surface to be soldered has been found to be dopant level below, the binary tin-copper eutectic point.
Read the whole patent
Listed from its CIPO record in Patent Yard's archive of Canadian patents past their term. Its claims, description and drawings are in the CIPO record and on Google Patents, and the Claude kit works from them.
Why it's free to use
- Filed October 6, 1989 and granted February 6, 1996. A Canadian patent filed from October 1, 1989 lasts 20 years from filing, so its term ended October 6, 2009.
- A certificate of supplementary protection adds at most two years for a drug, so even that would have ended by October 6, 2011.
- We check Canadian rights only. A patent in its family in another country could still be in force: check its family on Google Patents.
Timeline
Timeline From CIPO dates
Sources & verification
Official CIPO records
Everything on this page comes from the CIPO record linked above. Contains information licensed under the Open Government Licence – Canada.