Method of plasma enhanced silicon oxide deposition

Abstract From the Canadian patent

A method of depositing a hard silicon oxide based film is provided by controllably flowing a gas stream including an organosilicon compound into a plasma and depositing a silicon oxide onto a substrate while maintaining a pressure of less than about 100 microns during the depositing. The organosilicon compound is preferably combined with oxygen and helium and at least a portion of the plasma is preferably magnetically confined adjacent to a substrate during the depositing most, preferably by an unbalanced magnetron. These silicon oxide based films may be reproducibly deposited on small or large substrates, such as glass, plastic mineral or, metal, with preselected properties.