Electronic package comprising aluminum nitride and aluminum nitride-borosilicate glass composite

Abstract From the Canadian patent

An electronic package comprising dielectric layers including a densified aluminum nitride (AlN) base layer and at least one densified AlN-borosilicate glass composite layer bonded thereto is described. Any of the dielectric layers may be metallized with conductive circuit patterns and can contain conductive vias. Production of this package is accomplished by hot pressing a greenware laminate comprising a densified base (e.g. AlN); at least one green sinterable sheet (e.g. AlN-borosilicate glass composite); and a green sheet of non-sinterable material (e.g. boron nitride BN). The respective green sheets comprise homogeneous mixtures of the ceramic powders and a binder, e.g. polyethylene. The …