Solder composition
CA 1330168 C · Owner: Yagi, Hiroshi · Inventors: Yagi, Hiroshi; Tamashima, Atsuzo
Overview
Its claims, description and drawings are in the Canadian Patents Database.
Open the CIPO recordAbstract From the Canadian patent
A solder composition having a low melting point and a high remelting point sufficient to permit electronic circuit elements to be fixed on a printed circuit board at a low soldering temperature to prevent thermal damage of the electronic circuit elements during the mounting and prevent the elements from droppong off from the board due to any heat applied thereto after soldering. The solder composition includes a low melting solder powder containing a metal additive for melting-point depression and a reactive, alloy powder. The low melting solder powder is melted to form a soldering layer which serves to mount electronic circuit elements on a printed circuit board at a relatively low …
Read the whole patent
Listed from its CIPO record in Patent Yard's archive of Canadian patents past their term. Its claims, description and drawings are in the CIPO record and on Google Patents, and the Claude kit works from them.
Why it's free to use
- Granted June 14, 1994. A Canadian patent filed before October 1, 1989 lasted 17 years from grant, so its term ended June 14, 2011.
- We check Canadian rights only. A patent in its family in another country could still be in force: check its family on Google Patents.
Timeline
Timeline From CIPO dates
Sources & verification
Official CIPO records
Everything on this page comes from the CIPO record linked above. Contains information licensed under the Open Government Licence – Canada.