Flexible copper-applied substrates
CA 1324924 C · Owner: Konotsune, Shiro · Inventors: Hase, Hiroaki; Konotsune, Shiro; Uetsuki, Masaya
Overview
Its claims, description and drawings are in the Canadian Patents Database.
Open the CIPO recordAbstract From the Canadian patent
The present invention provides flexible copper-applied substrates which have high adhesive strength and which can prevent curling substantially even when exposed to chemical` and thermal changes, and a process for preparing these substrates. The flexible copper-applied substrate of the present invention comprises a copper foil and a resin layer comprising a composite material of a polyimide having a repeating unit represented by the following general formula (I) and a polyimide silicone having a repeating unit represented by the following general formula (II) the, aforesaid resin layer being directly formed on the surface of the copper foil:, (I), , , (I), wherein R1 R2, R3, R4, RS and R6 …
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Listed from its CIPO record in Patent Yard's archive of Canadian patents past their term. Its claims, description and drawings are in the CIPO record and on Google Patents, and the Claude kit works from them.
Why it's free to use
- Granted December 7, 1993. A Canadian patent filed before October 1, 1989 lasted 17 years from grant, so its term ended December 7, 2010.
- We check Canadian rights only. A patent in its family in another country could still be in force: check its family on Google Patents.
Timeline
Timeline From CIPO dates
Sources & verification
Official CIPO records
Everything on this page comes from the CIPO record linked above. Contains information licensed under the Open Government Licence – Canada.