Bending spring joint and process for its production
CA 1323639 C · Owner: Ebert, Wolfram · Inventors: Ebert, Wolfram; Hafen, Martin; Handrich, Eberhard
Overview
Its claims, description and drawings are in the Canadian Patents Database.
Open the CIPO recordAbstract From the Canadian patent
Abstract:, The present invention relates to a micromechanical bending spring joint of selectively etched silicon wafer material. The joint consists of two leaf springs arranged alongside each other, crossing and running obliquely with respect to the main areas of the wafer. The joint is obtained in one piece from the wafer by selective etching. The bending spring joint is characterized by high precision with regard to fulcrum position, bending spring constant and by high transverse axis rigidity.
Read the whole patent
Listed from its CIPO record in Patent Yard's archive of Canadian patents past their term. Its claims, description and drawings are in the CIPO record and on Google Patents, and the Claude kit works from them.
Why it's free to use
- Granted October 26, 1993. A Canadian patent filed before October 1, 1989 lasted 17 years from grant, so its term ended October 26, 2010.
- We check Canadian rights only. A patent in its family in another country could still be in force: check its family on Google Patents.
Timeline
Timeline From CIPO dates
Sources & verification
Official CIPO records
Everything on this page comes from the CIPO record linked above. Contains information licensed under the Open Government Licence – Canada.