Solder delivery systems
CA 1322898 C · Owner: Raychem Corporation · Inventors: Clifford, Thomas H.; Grassauer, Willie K.; Noel, Raymond
Overview
Its claims, description and drawings are in the Canadian Patents Database.
Open the CIPO recordAbstract From the Canadian patent
Mechanical means and methods for delivery of solder preforms arranged in generally rectilinear patterns and oriented so that the ends of the solder preforms may join two planar surfaces upon the application of heat are disclosed. Several embodiments facilitate the delivery of solder preforms in the forms of posts, clips3 and rings.
Read the whole patent
Listed from its CIPO record in Patent Yard's archive of Canadian patents past their term. Its claims, description and drawings are in the CIPO record and on Google Patents, and the Claude kit works from them.
Why it's free to use
- Granted October 12, 1993. A Canadian patent filed before October 1, 1989 lasted 17 years from grant, so its term ended October 12, 2010.
- We check Canadian rights only. A patent in its family in another country could still be in force: check its family on Google Patents.
Timeline
Timeline From CIPO dates
Sources & verification
Official CIPO records
Everything on this page comes from the CIPO record linked above. Contains information licensed under the Open Government Licence – Canada.