Package for integrated circuit
CA 1320006 C · Owner: Hirachi, Yasutake · Inventors: Hirachi, Yasutake; Hidaka, Norio
Overview
Its claims, description and drawings are in the Canadian Patents Database.
Open the CIPO recordAbstract From the Canadian patent
A package for an integrated circuit having conductor patterns which can be connected to an external circuit to connect the integrated circuit to the external circuit, comprising a dielectric plate which is provided on one end face with a grounding conductor. The conductor patterns are provided on the opposite end face of the dielectric plate. The first dielectric plate is provided with conductor poles which are located between the conductor patterns and which extend through the thickness of the dielectric plate to be connected to the grounding conductor.
Read the whole patent
Listed from its CIPO record in Patent Yard's archive of Canadian patents past their term. Its claims, description and drawings are in the CIPO record and on Google Patents, and the Claude kit works from them.
Why it's free to use
- Granted July 6, 1993. A Canadian patent filed before October 1, 1989 lasted 17 years from grant, so its term ended July 6, 2010.
- We check Canadian rights only. A patent in its family in another country could still be in force: check its family on Google Patents.
Timeline
Timeline From CIPO dates
Sources & verification
Official CIPO records
Everything on this page comes from the CIPO record linked above. Contains information licensed under the Open Government Licence – Canada.