Device for applying solder
CA 1317758 C · Owner: Myong, Inho · Inventors: Freimanis, Richard; Myong, Inho
Overview
Its claims, description and drawings are in the Canadian Patents Database.
Open the CIPO recordAbstract From the Canadian patent
A device for applying solder to two opposite faces of an object, such as an array of conductors of a flat electrical cable, in a predetermined location, comprises a support sheet having a line of weakness along which the sheet can be folded to define two arms, each having a free end; a quantity of solder located on a face of each of the arms of the support sheet; and means for controlling flow of the solder when heated, in a direction perpendicular to the line of weakness. The controlling means may be a strip of a resiliently deformable material.
Read the whole patent
Listed from its CIPO record in Patent Yard's archive of Canadian patents past their term. Its claims, description and drawings are in the CIPO record and on Google Patents, and the Claude kit works from them.
Why it's free to use
- Granted May 18, 1993. A Canadian patent filed before October 1, 1989 lasted 17 years from grant, so its term ended May 18, 2010.
- We check Canadian rights only. A patent in its family in another country could still be in force: check its family on Google Patents.
Timeline
Timeline From CIPO dates
Sources & verification
Official CIPO records
Everything on this page comes from the CIPO record linked above. Contains information licensed under the Open Government Licence – Canada.