R.f. interconnect and shielding system
CA 1317018 C · Owner: Hewlett-Packard Company · Inventors: Taylor, David Byard; Zemke, Steven C.
Overview
Its claims, description and drawings are in the Canadian Patents Database.
Open the CIPO recordAbstract From the Canadian patent
Interconnect and Shielding System, Abstract The connection and shielding system for modular RF circuits encases modular circuitboards (10) within five-sided enclosures (11). The sixth side of each enclosure is provided by the top ground plane of a base circuitboard (20) that supports and electrically interconnects the components of the modular circuitboards (10). Enclosures (11) are fixed to a grounded metal socket formed by fence strips (22) and metal inserts (23) which form upwardly open slots including yieldable longitudinal gaskets (50). Gaskets (50) yieldably grip the open end of enclosures (11) and seal them against escaping radiation. Further radiation shielding is provided about the …
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Listed from its CIPO record in Patent Yard's archive of Canadian patents past their term. Its claims, description and drawings are in the CIPO record and on Google Patents, and the Claude kit works from them.
Why it's free to use
- Granted April 27, 1993. A Canadian patent filed before October 1, 1989 lasted 17 years from grant, so its term ended April 27, 2010.
- We check Canadian rights only. A patent in its family in another country could still be in force: check its family on Google Patents.
Timeline
Timeline From CIPO dates
Sources & verification
Official CIPO records
Everything on this page comes from the CIPO record linked above. Contains information licensed under the Open Government Licence – Canada.