Circuit board material
CA 1312574 C · Owner: Ohmega Technologies, Inc. · Inventors: Rice, James M.; Mahler, Bruce P.
Overview
Its claims, description and drawings are in the Canadian Patents Database.
Open the CIPO recordAbstract From the Canadian patent
An improved multilayered circuit board material and process for making that material is disclosed. The material includes an insulating material support layer, an electrical resistance material layer adhering to the support layer and a, conductive material layer adhering to the resistance material layer and in intimate contact with that layer. The electrical resistance material layer comprises electroplated nickel-phosphorus containing up to about 30% by weight of phosphorus; however, no appreciable amounts of sulfur are present within at least the top about ten atomic layers of the electrical resistance material layer. As a result, the stability of the electrical resistance material layer …
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Listed from its CIPO record in Patent Yard's archive of Canadian patents past their term. Its claims, description and drawings are in the CIPO record and on Google Patents, and the Claude kit works from them.
Why it's free to use
- Granted January 12, 1993. A Canadian patent filed before October 1, 1989 lasted 17 years from grant, so its term ended January 12, 2010.
- We check Canadian rights only. A patent in its family in another country could still be in force: check its family on Google Patents.
Timeline
Timeline From CIPO dates
Sources & verification
Official CIPO records
Everything on this page comes from the CIPO record linked above. Contains information licensed under the Open Government Licence – Canada.