Method and apparatus for removing coating from substrate

Abstract From the Canadian patent

Abstract of the Disclosure In a method and apparatus for plasma stripping a polymer photoresist coating from a semiconductor substrate positively charged species are removed from an activated gas flow before the gas flow is brought into contact with the coating to strip the coating from the substrate. The positively charged species may be removed by bringing the activated gas into contact with a grounded conducting surface to discharge the positively charged species or by passing, the activated gas through a negatively charged electrostatic filter to filter out positively charged species. The removal of positively charged species from the gas flow reduces or eliminates build up of positive …