Orbital wave soldering of printed circuit boards
CA 1311064 C · Owner: Italtel Societa Italiana Telecomunicazioni S.P.A. · Inventors: Scorta, Roberto
Overview
Its claims, description and drawings are in the Canadian Patents Database.
Open the CIPO recordAbstract From the Canadian patent
The description refers to a device and a procedure for the wavesoldering of printed circuits, in particular for the soldering of components suitable for surface mounting. The soldering wave - or a portion of the same - is formed by molten solder flows progressing in an orbital direction. Said flows can progress horizontally with a direction that cyclically moves between 0 and 360°, causing the removing of gas/air bubbles - in case they are trapped near a component - in any position they stagnate. Any soldering failure due to "dry soldering" is therefore avoided.
Read the whole patent
Listed from its CIPO record in Patent Yard's archive of Canadian patents past their term. Its claims, description and drawings are in the CIPO record and on Google Patents, and the Claude kit works from them.
Why it's free to use
- Granted December 1, 1992. A Canadian patent filed before October 1, 1989 lasted 17 years from grant, so its term ended December 1, 2009.
- We check Canadian rights only. A patent in its family in another country could still be in force: check its family on Google Patents.
Timeline
Timeline From CIPO dates
Sources & verification
Official CIPO records
Everything on this page comes from the CIPO record linked above. Contains information licensed under the Open Government Licence – Canada.