Package for emi, esd, thermal, and mechanical shock protection of circuit chips
CA 1310432 C · Owner: Casabona, Richard J. · Inventors: Casabona, Richard J.; Fenwick, David M.; Barker, Charles R. Iii
Overview
Its claims, description and drawings are in the Canadian Patents Database.
Open the CIPO recordAbstract From the Canadian patent
A package for integrated circuit chips or other elec-, trical devices, provides mechanical shock and thermal protection for the chips, and in addition, protects the chips from electromagnetic interference and electrostatic discharge. The package includes a printed wiring board base for reception of one or more circuit chips, and a conductive heat sink and cover. The conductive heat sink, in conjunction with a reference plane in the wiring board base, acts as an EMI shield for the chips. The heat sink is covered with an insulating layer on top of which, a con-, ductive coaling is placed. The conductive coaling is electrically connected to the reference plane, and the two act to protect the …
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Listed from its CIPO record in Patent Yard's archive of Canadian patents past their term. Its claims, description and drawings are in the CIPO record and on Google Patents, and the Claude kit works from them.
Why it's free to use
- Granted November 17, 1992. A Canadian patent filed before October 1, 1989 lasted 17 years from grant, so its term ended November 17, 2009.
- We check Canadian rights only. A patent in its family in another country could still be in force: check its family on Google Patents.
Timeline
Timeline From CIPO dates
Sources & verification
Official CIPO records
Everything on this page comes from the CIPO record linked above. Contains information licensed under the Open Government Licence – Canada.