Connection structure between components for semiconductor apparatus
CA 1308494 C · Owner: Takeuchi, Hisao · Inventors: Yamakawa, Akira; Akazawa, Hitoshi; Sasame, Akira
Overview
Its claims, description and drawings are in the Canadian Patents Database.
Open the CIPO recordAbstract From the Canadian patent
A connection structure between lead frames and a base plate of aluminum nitride, to be applied as a connection structure between components of a semiconductor apparatus comprises the base plate formed of a sintered body of aluminum nitride on which a semiconductor device is to be mounted, the lead frames including, as a main material iron alloy containing nickel in 29 wt.% and cobalt in 17 wt.%, and silver solder for joining the base plate and the lead frames. A surface of the lead frame to be joined to the base plate is formed of oxygen-free copper of a high plastic deformativity to relieve, by plastic deformation of itself, a thermal stress caused by a difference between a thermal …
Read the whole patent
Listed from its CIPO record in Patent Yard's archive of Canadian patents past their term. Its claims, description and drawings are in the CIPO record and on Google Patents, and the Claude kit works from them.
Why it's free to use
- Granted October 6, 1992. A Canadian patent filed before October 1, 1989 lasted 17 years from grant, so its term ended October 6, 2009.
- We check Canadian rights only. A patent in its family in another country could still be in force: check its family on Google Patents.
Timeline
Timeline From CIPO dates
Sources & verification
Official CIPO records
Everything on this page comes from the CIPO record linked above. Contains information licensed under the Open Government Licence – Canada.