Conductive metallization of substrates via developing agents
CA 1308311 C · Owner: Moy, Paul Yuet Yee · Inventors: Parr, William John; Hutton, Ronald Eric; Moy, Paul Yuet Yee
Overview
Its claims, description and drawings are in the Canadian Patents Database.
Open the CIPO recordAbstract From the Canadian patent
A conductive metal layer is formed on a substrate by depositing copper or nickel particles on the substrate contacting the metal, particles with a specified developing agent and heating the metal, particles and the developing agent. The coated substrates have conductive surfaces and are useful for a variety of uses such as EMI shielding and printed circuit boards.
Read the whole patent
Listed from its CIPO record in Patent Yard's archive of Canadian patents past their term. Its claims, description and drawings are in the CIPO record and on Google Patents, and the Claude kit works from them.
Why it's free to use
- Granted October 6, 1992. A Canadian patent filed before October 1, 1989 lasted 17 years from grant, so its term ended October 6, 2009.
- We check Canadian rights only. A patent in its family in another country could still be in force: check its family on Google Patents.
Timeline
Timeline From CIPO dates
Sources & verification
Official CIPO records
Everything on this page comes from the CIPO record linked above. Contains information licensed under the Open Government Licence – Canada.