Soft-faced semiconductor component backing
CA 1307355 C · Owner: Degree, David C. · Inventors: Fick, Herbert J.; Degree, David C.; Hanson, Kevin L.
Overview
Its claims, description and drawings are in the Canadian Patents Database.
Open the CIPO recordAbstract From the Canadian patent
A thermally conductive interface for positionably mounting encapsulated semiconductor devices onto a chassis or other mounting surface. The interface comprises a soft pliable plastic layer of a synthetic resin selected from the group consisting of silicone rubber, epoxy, polyester and polyurethane bonded to a planar surface of the sheath portion of an encapsulated semiconductor device. The pliable layer has a thickness less than about 10 mils and a hardness of between about 10 and 60 durometer.
Read the whole patent
Listed from its CIPO record in Patent Yard's archive of Canadian patents past their term. Its claims, description and drawings are in the CIPO record and on Google Patents, and the Claude kit works from them.
Why it's free to use
- Granted September 8, 1992. A Canadian patent filed before October 1, 1989 lasted 17 years from grant, so its term ended September 8, 2009.
- We check Canadian rights only. A patent in its family in another country could still be in force: check its family on Google Patents.
Timeline
Timeline From CIPO dates
Sources & verification
Official CIPO records
Everything on this page comes from the CIPO record linked above. Contains information licensed under the Open Government Licence – Canada.