High density backplane connector
CA 1306520 C · Owner: Corbesero, Steve R. · Inventors: Corbesero, Steve R.; Goff, Jay T.; Cotter, Neil J.
Overview
Its claims, description and drawings are in the Canadian Patents Database.
Open the CIPO recordAbstract From the Canadian patent
A high density backplane (HDB) connector is provided for electrically interconnecting high density printed circuit boards. The printed circuit boards have a predetermined geometric conductive pattern which includes high density arrays of individual signal/power contact interconnects and unitary ground strips. The HDB connector comprises a housing module secured to one board and a stiffener module secured to a second board. A compliant contact module mounted within the housing module includes a resilient member, an insulator member having arrays of free-floating rigid contact pins disposed therein and, a flexile film interposed therebetween. The flexile film has a signal/power conductive …
Read the whole patent
Listed from its CIPO record in Patent Yard's archive of Canadian patents past their term. Its claims, description and drawings are in the CIPO record and on Google Patents, and the Claude kit works from them.
Why it's free to use
- Granted August 18, 1992. A Canadian patent filed before October 1, 1989 lasted 17 years from grant, so its term ended August 18, 2009.
- We check Canadian rights only. A patent in its family in another country could still be in force: check its family on Google Patents.
Timeline
Timeline From CIPO dates
Sources & verification
Official CIPO records
Everything on this page comes from the CIPO record linked above. Contains information licensed under the Open Government Licence – Canada.