Integrated circuit having laser-alterable metallization layer

Abstract From the Canadian patent

An integrated circuit and a method of altering such an integrated circuit (e.g. during final testing of the circuit) are disclosed. The method can be used to program a circuit, wire around defective portions of a circuit or, otherwise permanently alter a circuit by employing a directed energy source such as a laser to sever electrical paths in an upper layer of metallization in an integrated circuit. The integrated circuit comprises a laminated upper metallization layer, the upper layer(s) of which laminate are removed from the laser-alterable lower layer at selected locations in the metallization layer to provide laser-alteration sites in the circuit. In a preferred embodiment, the upper …