Burn-in pads for tab interconnect structures
CA 1303752 C · Owner: Digital Equipment Corporation · Inventors: Chase, Richard A.
Overview
Its claims, description and drawings are in the Canadian Patents Database.
Open the CIPO recordAbstract From the Canadian patent
Abstract, A tape automated bonding tape segment carries on its top surface a printed circuit interconnect conductor high-density array having a plurality of signal, power and ground conductors. Burn-in testing pads are formed on either the top surface o. the bottom surface of the tape segment or both, and are connected to selected conductors. The testing pads are spaced apart and have a relatively low density to facilitate contact with test equipment, whereby a die connected to the printed circuit array can be tested.
Read the whole patent
Listed from its CIPO record in Patent Yard's archive of Canadian patents past their term. Its claims, description and drawings are in the CIPO record and on Google Patents, and the Claude kit works from them.
Why it's free to use
- Granted June 16, 1992. A Canadian patent filed before October 1, 1989 lasted 17 years from grant, so its term ended June 16, 2009.
- We check Canadian rights only. A patent in its family in another country could still be in force: check its family on Google Patents.
Timeline
Timeline From CIPO dates
Sources & verification
Official CIPO records
Everything on this page comes from the CIPO record linked above. Contains information licensed under the Open Government Licence – Canada.