Structure for temperature detection in a package
CA 1303239 C · Owner: Umezawa, Kazuhiko · Inventors: Umezawa, Kazuhiko
Overview
Its claims, description and drawings are in the Canadian Patents Database.
Open the CIPO recordAbstract From the Canadian patent
Disclosed is a structure for detecting the temperature of a package having a substrate mounting a plurality of integrated circuit (IC) chips. It is known to provide an IC package with a temperature sensor so that if the sensed temperature exceeds a predetermined value a, protective measure such as an interruption of power supply can be taken. However, prior art temperature sensing structures have the disadvantage that a part protrudes from the IC package and is apt to be hit and damaged when the IC package is mounted, dismounted or transported. An associated cable connection can also be damaged. The present invention avoids those disadvantages by providing a temperature sensing block for a …
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Listed from its CIPO record in Patent Yard's archive of Canadian patents past their term. Its claims, description and drawings are in the CIPO record and on Google Patents, and the Claude kit works from them.
Why it's free to use
- Granted June 9, 1992. A Canadian patent filed before October 1, 1989 lasted 17 years from grant, so its term ended June 9, 2009.
- We check Canadian rights only. A patent in its family in another country could still be in force: check its family on Google Patents.
Timeline
Timeline From CIPO dates
Sources & verification
Official CIPO records
Everything on this page comes from the CIPO record linked above. Contains information licensed under the Open Government Licence – Canada.